METHOD FOR REUSING PEELED WAFER AND SILICON WAFER TO BE PROVIDED FOR REUSE

摘要

PROBLEM TO BE SOLVED: To improve the productivity of an SOI(silicon on-insulator) wafer having an SOI layer with actually high quality, and to reduce costs, by providing a method for operating proper re-processing to a peeled wafer being a by- product in a hydrogen ion peeling method for actually reusing it as a silicon wafer, providing a method for reducing costs for the re-processing of the peeled wafer, and reprocessing an expensive wafer such as an epitaxial wafer many times for reusing this many times. ;SOLUTION: This is a method for adding re-processing to a peeled wafer being a by-product at the time of manufacturing an SOI wafer by a hydrogen ion peeling method for reusing this as a silicon wafer. In this case, this is a method for reusing the peeled wafer by operating at least grinding for removing a peripheral difference in step and heat-treatment under a reduction atmosphere containing hydrogen to the peeled wafer as the re-processing. Also, a silicon wafer to be provided for reuse can be obtained by this re-processing in this method.;COPYRIGHT: (C)1999,JPO