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te - pingu electronic parts aggregate

机译:特 - 聘雇electronic part是aggregate

摘要

PROBLEM TO BE SOLVED: To provide a taping electronic part assembly, wherein electrostatic breakdown is easily prevented while the measurement of electrical characteristics is made possible. SOLUTION: First and second leads 15 and 16 of a plurality of light-emitting diodes 11 are held with first and second tape-like members 12 and 13 to constitute an assembly. The first tape-like member 12 is provide with a resistance material layer 28. The resistance material layer 28 is connected to the first and second leads 15 and 16. A resistance value of the resistance material layer 28 between the first and second leads 15 and 16 contributes to an electric discharge of static electricity, and it is of about 105 -107 Ω range for enabling check of the leak current of the light-emitting diode 11.
机译:解决的问题:提供一种带式电子部件组件,其中在能够进行电特性的测量的同时容易防止静电击穿。解决方案:多个发光二极管11的第一和第二引线15和16与第一和第二带状构件12和13固定在一起,以构成一个组件。第一带状构件12设置有电阻材料层28。电阻材料层28连接到第一引线15和第二引线16。电阻材料层28在第一引线15和第二引线15之间的电阻值。 16有助于静电的放电,并且其在大约10 5 -10 7Ω的范围内,以使得能够检查发光二极管11的泄漏电流。

著录项

  • 公开/公告号JP2950294B2

    专利类型

  • 公开/公告日1999-09-20

    原文格式PDF

  • 申请/专利权人 SANKEN DENKI KK;

    申请/专利号JP19970200952

  • 发明设计人 SHIRAISHI AKIRA;SANO TAKESHI;

    申请日1997-07-09

  • 分类号H01L33/00;B65D73/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:32:27

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