RESIN COMPOSITION FOR COPPER-CLAD LAMINATE, COPPER FOIL WITH RESIN, MULTILAYER COPPER-CLAD LAMINATE AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition having high heat resistance and showing extremely high crack resistance even in being subjected to mechanical shock and thermal shock, a copper foil with a resin using the same, a multilayer copper-clad laminate and a multilayer printed wiring board using the resin composition and the copper foil with a resin. ;SOLUTION: This resin composition for a copper-clad laminate comprises (1) an epoxy resin blend composed of an epoxy resin and its curing agent, (2) a maleimide compound and (3) a polyvinyl acetal resin containing a hydroxyl group and a functional group except a hydroxyl group, polymerizable with an epoxy resin or a maleimide compound. A copper foil with a resin is obtained by coating one side of a copper foil with the composition as an interlaminar insulating resin component for a multilayer printed wiring board. The resin composition is used as an insulating resin layer between copper foils for an internal circuit and an external layer circuit to give the objective multilayer printed wiring board.;COPYRIGHT: (C)1999,JPO