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EPITAXIAL WAFER FOR GAP LIGHT EMITTING DIODE AND GAP LIGHT EMITTING DIODE
EPITAXIAL WAFER FOR GAP LIGHT EMITTING DIODE AND GAP LIGHT EMITTING DIODE
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机译:间隙发光二极管和间隙发光二极管的晶片
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摘要
PROBLEM TO BE SOLVED: To provide a GaP light emitting diode of high luminance. ;SOLUTION: This light emitting diode is formed of an epitaxial wafer for a GaP light emitting diode in which a PN junction is formed by laminating at least one N-type GaP epitaxial layer and at least one P-type GaP epitaxial layer on a GaP single crystal substrate. In this case, the dislocation density (EPD) of the GaP single crystal substrate described above is at most 3×10-3 cm-3, the dopant of the GaP single crystal substrate is tellurium(Te) or silicon(Si), and the concentration of sulfur (S) in the GaP single crystal substrate is at most 5×1016 cm-3.;COPYRIGHT: (C)1999,JPO
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机译:要解决的问题:提供高亮度的GaP发光二极管。 ;解决方案:此发光二极管由用于GaP发光二极管的外延晶片形成,其中通过在GaP上层压至少一个N型GaP外延层和至少一个P型GaP外延层形成PN结单晶衬底。在这种情况下,上述GaP单晶衬底的位错密度(EPD)最多为GaP单晶的掺杂剂3×10 -3 Sup> cm -3 Sup>。晶体衬底是碲(Te)或硅(Si),GaP单晶衬底中的硫(S)浓度最高为5×10 16 Sup> cm -3 Sup > .;版权:(C)1999,日本特许厅
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