The manner soldered the electronic parts in the print patchboard and production manner null of the assembly body which uses the device, and its

摘要

PURPOSE: To restrict temperature rise of and difference between a printed board and an electronic part to a minimum by applying energy of infrared rays of easily absorbed spectrum to the printed board and the electronic part for heating them. ;CONSTITUTION: Two far infrared radiation heaters 50 and six near infrared radiation heaters 40 are arranged in two lines and four columns along the carrying direction so as to sandwich the carrying path of a printed wiring board 5 from above and below. One set of far infrared radiation heaters 50 and one set of near infrared radiation heater 40 are used for preliminary heating and the remaining two sets are used for main heating. And the far infrared radiation heater 50 and the near infrared radiation heater 40 in the auxiliary heating zone Z1 apply infrared rays with the wavelengths easily absorbed by the printed wiring board 5 and electronic parts respectively. By doing this, the temperature control of the printed wiring board and electronic parts can be performed individually. Therefore, the temperature rise and difference of both of them can be restricted to a minimum and also the connections can be soldered very reliably.;COPYRIGHT: (C)1996,JPO