首页> 外国专利> Method for electrochemically etching a p-type semiconducting material, and a substrate of at least partly porous semiconducting material

Method for electrochemically etching a p-type semiconducting material, and a substrate of at least partly porous semiconducting material

机译:电化学蚀刻p型半导体材料的方法以及至少部分多孔的半导体材料的衬底

摘要

The invention relates to a method of electrochemically etching a p-type semiconductor material, characterized by the following steps: a) the application of mask material on a substrate of the p-type semiconductor material; b) the local removal of the mask material; and c) placing the substrate with the mask into a corrosive electrolytic solution while simultaneously applying a current density through the substrate; wherein the current density during step c) is adjusted alternatingly to a high value causing the semiconductor material to be completely etched away, and a low value corroding the semiconductor material such as to become porous.
机译:本发明涉及一种电化学蚀刻p型半导体材料的方法,其特征在于以下步骤:a)在p型半导体材料的衬底上施加掩模材料; b)局部去除掩模材料; c)将带有掩模的基片放置在腐蚀性电解液中,同时通过基片施加电流密度;其中,将步骤c)中的电流密度交替地调节至高值,使得半导体材料被完全蚀刻掉,而低值腐蚀半导体材料,从而变得多孔。

著录项

  • 公开/公告号AU2860599A

    专利类型

  • 公开/公告日1999-09-20

    原文格式PDF

  • 申请/专利权人 STICHTING VOOR DE TECHNISCHE WETENSCHAPPEN;

    申请/专利号AU19990028605

  • 发明设计人 RINT WILLEM TJERKSTRA;

    申请日1999-03-02

  • 分类号H01L21/3063;H01L21/306;C25F3/14;

  • 国家 AU

  • 入库时间 2022-08-22 02:23:06

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