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Method and apparatus for optical emission end point detection in plasma etching processes
Method and apparatus for optical emission end point detection in plasma etching processes
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机译:用于等离子体蚀刻工艺中的光发射终点检测的方法和设备
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摘要
An apparatus and method for determining the time at which a plasma etching process should be terminated. The process generates at least one etch product species and a continuum plasma emission. The apparatus monitors the optical emission intensity of the plasma in a narrow band centered about a predetermined spectral line and generates a first signal indicative of the spectral intensity of the etch product species. The apparatus further monitors the optical emission intensity of the plasma in a wide band and generates a second signal indicative of the spectral intensity of the continuum plasma emission. The apparatus further monitors the magnitudes of the first and second signals and generates a termination signal when the magnitudes diverge.
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