Polycrystalline diamond cutting element with diamond ridge pattern

摘要

This invention relates to a novel domed polycrystalline diamond cutting element wherein a hemispherical diamond layer is bonded to a tungsten carbide substrate, commonly referred to as a tungsten carbide stud. Broadly, a pattern of ridges or bumps is integrally formed in the abrasive layer which ridges are designed to cause high localized stresses in the rock, thus starting a crack. By initiating cracks in localized areas, the crushing action could be performed with less force.