Lead frame plating apparatus and lead frame plating method therefor

摘要

According to the present invention, there is provided a plating apparatus comprising: a plating vessel capable of receiving a plating solution; a wetting member provided at one side of the plating vessel and capable of always maintaining a wet state by a plating solution supplied from the plating vessel; There is provided a lead frame plating apparatus including an electrode member provided so as to be capable of performing plating, and a plating method therefor. The lead frame plating apparatus and the lead frame plating method according to the present invention are capable of selectively plating a specific portion requiring plating in the surface of the lead frame and have the advantages of being less harmful to the human body and environment due to the plating process .