Slurry Supply System of Semiconductor CMP (CMP) Process

摘要

The present invention relates to a supply system of a slurry used for chemically reacting a surface of a wafer during planarization of an aperture surface, comprising: a variable supply pipe penetrating into a tank and having an inlet provided at an end thereof at a predetermined depth from a water surface of the slurry; Expansion joint means for connecting the one end of the variable supply pipe located outside the tank to the main supply pipe connected to the CMP equipment so that the variable supply pipe can move in the vertical direction; And a position varying means for moving the variable supply pipe in the vertical direction so as to be positioned so as to be located at a set depth from the water surface of the slurry.;Therefore, the suction port of the variable supply pipe moves upward and downward in correspondence with the increase / decrease of the slurry in the tank, so that the suction port can be maintained at a predetermined depth with respect to the water surface at all times. As a result, the slurry deformations or lumps, It is possible to reduce the supply amount of CMP equipment to the CMP equipment.