CMP integration system for quality prediction and adjustment of abrasive slurries for semiconductor CMP process

摘要

Disclosed is an integration system for estimating and adjusting the quality by measuring an abrasive of a semiconductor chemical-mechanical polishing (CMP) process, which includes a mixer that mixes slurry and chemicals to produce the abrasive, sensors for inspecting the required characteristics of the abrasive, and a programmable lock controller (PLC) for determining the abnormality of the abrasive by receiving inspection values of the sensors and determining the supply of the abrasive supply. The inspection values of the sensors are stored as a material and patterns indicated by the inspection values before and during the supply of the abrasive in a distribution system are learned based on these data. The abnormality in the supply of the abrasive, which is currently supplied, or an abnormal symptom are displayed to the outside, based on the learning results. According to the present invention, it is possible to prevent abrasive supply interruption as much as possible or to reduce the interruption time when an abnormal inspection value for the abrasive is generated in the system. In addition, the abnormal symptom is detected in advance even before the abnormal inspection value occurs and the countermeasures against the abnormal symptom may be made, thereby preventing the abrasive from being stopped or reducing the stop time. Accordingly, the operating rate and efficiency of the system may be increased.