Selective repetitive inspection method of semiconductor chip package and inspection apparatus having jig used therein

摘要

The present invention relates to a method for inspecting the electrical characteristics of a semiconductor chip package, and to reduce the time and cost of the inspection process by performing a selective and repetitive characteristic inspection compared to the conventional method of separately collecting and inspecting the defective products according to the inspection results In order to solve the problem, the present invention discloses an electrical property inspection method for repeatedly inspecting a product by disconnecting the electrical connection between the package and the tester (tester) without carrying the package and reconnecting the package. Using a processor (handler) or a pressurizing part of the processor as a means of disconnecting and reconnecting the tester, and presenting a case where the jig is installed and used as a means of separating and reconnecting the package and the tester in the cam type electrical property inspection device. Electrical Characteristics of Semiconductor Chip Packages with Jig Used The inspection apparatus is started.