End point detection method of process, end point detection device and recording medium and chemical mechanical polishing device

摘要

The present invention relates to a chemical mechanical polishing apparatus including a method for detecting the end point of a process in a manufacturing process and an inspection process, an apparatus used for the implementation thereof, a recording medium on which the computer program is recorded, and an end point detection device for the process. In order to be able to determine the end point in a short time and to reduce the cost without performing the test, the end point of the process is obtained by measuring time-series data over time by measuring physical quantities that change with the progress of the process. In the method of detecting a time interval, each time time series data of a predetermined time domain is obtained, first time series data which is a part thereof and second time series data delayed by a predetermined delay time are extracted from the first time series data, Calculate the correlation of the obtained time series data And, therefore, it was a structure which determines the end point of the process on the result.;As a result, the end point can be detected in a short time, the device cost can be reduced, and there is no need to execute several tests in advance, the end point can be easily detected, and each correlation obtained can be statistically processed to determine the end point. The judgment accuracy is improved, and the effect that the end point can be detected with little effort is obtained.