Sensor fixing structure of temperature measuring device for semiconductor track equipment

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor fixing structure of a temperature measuring device for semiconductor track equipment, wherein a plurality of grooves 11a having a predetermined depth smaller than a bottom surface thereof are formed on an upper surface of a test wafer 11, and the bottom surfaces of the grooves 11a are formed. After placing the heat sensor 12 in each, the epoxy 15 is injected into the recess 11a to fix the heat sensor 12, so that the test wafer 11 and the epoxy 15 for long-term repeated use may be used. Due to the difference in the thermal expansion coefficient of the epoxy 15 is essentially prevented from falling.