QEP, IC inspection device and inspection method

摘要

Disclosed are an inspection apparatus and a method for inspecting a printed circuit board mounted component capable of inspecting soldering states of mounted QFP and IC, and the like.;After the QFP and IC are mounted on the insulator circuit board, inspection of the soldering state is required, but there is no proper inspection device or method for this, which causes a lot of losses in terms of economy and work efficiency.;In order to solve this problem, an inspection tool having an insertion groove formed in a predetermined shape on the lower surface, conductive rubber inserted into the insertion groove of the inspection tool, an axis for guiding and supporting the inspection tool, inserted into the shaft to support the inspection tool A spring, an upper structure in which an inspection tool is installed, a plurality of contact pins which are in electrical contact with the lower structure of the substrate when the upper structure is lowered, and a lower structure in which the contact pins are installed, and an electrical current for applying a current to the contact pins. A test apparatus for inspecting a printed circuit board mounted component including a connected control means, and a test method thereby.;Such inspection apparatus and inspection method can be applied to inspection of mounting components of various printed circuit boards.