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Anti-reflection film for a CRT has a thick uppermost silicon oxide film above a thinner indium-tin oxide film

机译:用于CRT的减反射膜在较薄的铟锡氧化物膜上方具有最厚的最上面的氧化硅膜

摘要

In an anti-reflection silicon oxide and indium-tin oxide (ITO) multilayer film, the uppermost silicon oxide film (25) is thicker than the immediately underlying ITO film (24). An anti-reflection film comprises a multilayer of silicon oxide and indium-tin oxide (ITO) films (21, 22) on a base film (11), the uppermost silicon oxide film (25) being thicker than the immediately underlying ITO film (24). An Independent claim is also included for production of the above anti-reflection film. Preferred Features: The lowermost film (21), adjacent the base film (11), is a SiOx film (x = 0.5-1.9) which is deposited while controlling the degree of oxidation of silicon by measuring the light absorption of the film (21). Prior to forming the lowermost silicon oxide film (21), the base film (11) is subjected to a surface activation treatment by glow discharge using an aluminum electrode. All the films are formed using a dual magnetron sputtering system.
机译:在抗反射氧化硅和铟锡氧化物(ITO)多层膜中,最上面的氧化硅膜(25)比紧接在下面的ITO膜(24)厚。减反射膜包括在基膜(11)上的多层氧化硅和氧化铟锡(ITO)膜(21、22),最上面的氧化硅膜(25)厚于紧邻的ITO膜( 24)。上面的减反射膜的生产也包括独立权利要求。优选的特征:与基膜(11)相邻的最下面的膜(21)是SiO x膜(x = 0.5-1.9),其被沉积,同时通过测量膜(21)的光吸收来控制硅的氧化程度。 )。在形成最下层的氧化硅膜(21)之前,使用铝电极通过辉光放电对基膜(11)进行表面活化处理。所有膜均使用双磁控溅射系统形成。

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