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process for the manufacture of high-voltage and low-voltage cmos transistors on a single integrated schaltungs chip

机译:单个集成式结构芯片上制造高压和低压cmos晶体管的方法

摘要

A process for forming both low-voltage CMOS transistors and high-voltage CMOS transistors on a common integrated circuit chip uses a common implantation and drive-in step to form both the n-type well (174,374) of each PMOS transistor and the n-type drain extension well (274) of each lightly-doped drain (LDD) NMOS transistor and a separate implant and drive-in to form the p-type drain extension well (182) of each LDD PMOS transistor.
机译:在公用集成电路芯片上同时形成低压CMOS晶体管和高压CMOS晶体管的工艺使用公用的注入和驱动步骤来形成每个PMOS晶体管的n型阱(174,374)和n-阱每个轻掺杂漏极(LDD)NMOS晶体管的p型漏极扩展阱(274)以及单独的注入和驱动以形成每个LDD PMOS晶体管的p型漏极扩展阱(182)。

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