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Method of coating a conductive substance on a transparent electrode formed on a substrate and method of mounting a semiconductor device or film substrate on the substrate

机译:在形成于基板上的透明电极上涂覆导电物质的方法以及在基板上安装半导体器件或膜基板的方法

摘要

A method of coating a conductive substance on a transparent electrode disposed on a substrate comprises disposing a resin containing the conductive substance over the surface of the substrate, and rubbing and pressing the resin over the surface of the substrate with a pressing shaft to coat a layer of the resin on the transparent electrode. A method of mounting a semiconductor device or the film substrate on the substrate having the transparent electrode coated with the resin layer containing the conductive substance comprises connecting a terminal portion of the semiconductor device or film substrate to the transparent electrode through the resin layer.
机译:在设置在基板上的透明电极上涂覆导电物质的方法包括:将包含导电物质的树脂设置在基板的表面上;以及利用压轴在基板的表面上摩擦并压制树脂,以涂覆层透明电极上的树脂。在具有透明电极的基板上安装半导体器件或薄膜基板的方法是,该透明电极涂覆有包含导电物质的树脂层,该半导体器件或薄膜基板的端子部分通过树脂层连接至透明电极。

著录项

  • 公开/公告号US5860212A

    专利类型

  • 公开/公告日1999-01-19

    原文格式PDF

  • 申请/专利权人 SEIKO INSTRUMENTS INC.;

    申请/专利号US19950408319

  • 发明设计人 TSUTOMU MATSUHIRA;

    申请日1995-03-22

  • 分类号H05K3/34;

  • 国家 US

  • 入库时间 2022-08-22 02:08:57

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