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Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof
Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof
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机译:具有交叉指信号和接地引线的引线框架,高频引线位于拐角附近,并在其两侧被接地引线屏蔽
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摘要
A lead-frame is sealed in a full-mold insulating package together with a semiconductor chip; the lead-frame has a conductive die pad for mounting the semiconductor chip, first conductive leads integral with the conductive die pad and electrically connected through conductive wires to bonding pads of the semiconductor chip so as to supply a ground potential to the semiconductor chip and second conductive leads separated from the conductive die pad so as to supply high-frequency input signals through conductive wires to other bonding pads, and the second conductive leads are respectively located between the first conductive leads and other first conductive leads closest to the corners of the full-mold package so that a good electrical isolation is provided between the second conductive leads.
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