首页> 外国专利> TO-housing for high frequency applications, has leads arranged relative to one another to provide intermediate signal carrying lead at ground potential

TO-housing for high frequency applications, has leads arranged relative to one another to provide intermediate signal carrying lead at ground potential

机译:用于高频应用的TO外壳,引线彼此相对布置,以在接地电位下提供中间信号传输引线

摘要

A TO-housing for HF applications has a press-stamped part (2) as base carrying electronic components and which is sealed by a cup-shaped cover and in which electric leads (3) are carried through the entrance borings (4) into the press-stamped part (2). The leads (3) have a primarily rectangular cross-section and are arranged spatially relative to one another so that between two leads (3) a signal carrying lead (3) lies at ground potential.
机译:用于HF应用的TO外壳具有一个压印部分(2)作为承载电子元件的底座,并由杯形盖密封,其中电线(3)通过入口孔(4)进入外壳。冲压件(2)。引线(3)具有基本为矩形的横截面,并且在空间上相对于彼此布置,使得信号承载引线(3)在两个引线(3)之间处于地电势。

著录项

  • 公开/公告号DE10221706A1

    专利类型

  • 公开/公告日2003-11-27

    原文格式PDF

  • 申请/专利权人 SCHOTT GLAS;

    申请/专利号DE2002121706

  • 发明设计人 HETTLER ROBERT;HEEKE NEIL;

    申请日2002-05-16

  • 分类号H01L23/055;H01L23/50;H01L23/64;

  • 国家 DE

  • 入库时间 2022-08-21 22:44:13

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