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Method of fabricating high-frequency GaAs substrate-based Schottky barrier diodes

机译:高频GaAs基肖特基势垒二极管的制造方法

摘要

A Schottky barrier diode and a method for fabricating a Schottky barrier diode that utilizes HBT active device layers. The Schottky barrier diode is formed with a vertically integrated profile on a GaAs substrate, with a subcollector layer and a collector layer. A suitable dielectric material is deposited on top of the collector layer. Vias are formed in the collector layer and subcollector layer for the barrier and ohmic contacts. The collector via is relatively deeply etched into the collector layer to lower the series resistance between the barrier and ohmic contacts, which results in relatively higher cut-off frequency performance.
机译:肖特基势垒二极管和利用HBT有源器件层的肖特基势垒二极管的制造方法。肖特基势垒二极管在GaAs衬底上形成垂直集成的轮廓,并具有子集电极层和集电极层。合适的介电材料沉积在收集器层的顶部。在势垒和欧姆接触的集电极层和子集电极层中形成过孔。集电极通孔被相对较深地蚀刻到集电极层中,以降低势垒和欧姆接触之间的串联电阻,这导致相对较高的截止频率性能。

著录项

  • 公开/公告号US5930636A

    专利类型

  • 公开/公告日1999-07-27

    原文格式PDF

  • 申请/专利权人 TRW INC.;

    申请/专利号US19960645361

  • 申请日1996-05-13

  • 分类号H01L21/331;H01L21/00;H01L21/338;H01L31/0328;

  • 国家 US

  • 入库时间 2022-08-22 02:07:39

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