首页>
外国专利>
Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling
Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling
展开▼
机译:用于将超大规模集成(VLSI)芯片封装安装到计算机机箱以进行冷却的方法和设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
展开▼