A STUDY ON COOLING METHODS TO DECREASE THE INTERNAL TEMPERATURE OF THE CHIP MOUNTER

摘要

As a chip mounter demands the high speed and accuracy, the exact reviews of thermal deformations are necessary in these equipments although those are a relatively small. These deformations have a bad influence on the specification of the product or its productivity because the products are manufactured with a micro scale accuracy. The linear motor in chip mounter has an advantage that more comfortably control the linear motion of the motor than the rotary or ball-screw type one. But the linear motor has a disadvantage about thermal problem than the other types. The heat has an effect on the life of the motor and its performance. It causes the mechanical errors by thermal stress and deformation. The heat transfer analysis is complex in chip mounter because of a plate being contacted with the moving linear motor coil on the fixed frame with which the magnetic is attached. For this reason, the trial & error methods have been used for most cases. In this research, we analyzed the thermal stress and deformation of the plate being contacted with the linear motor coil and thermal problems in the equipment using CFD. The reliability of the numerical analysis is verified by being compared with the experimental results. The suggested model is investigated with installing the fans on the upper cover, which confirmed decreased the temperature on the important parts of the equipment.