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Finishing device null of lead/read

机译:整理装置无铅/已读

摘要

PURPOSE: To continuously perform surface treatment in a state where the occurrence of uneven treatment is reduced at the time of surface-treating a strip-like lead frame by electrolytic processing or electrolysis, such as electroplating, etc. ;CONSTITUTION: An endless carrying belt body 4 is provided above an electrolytic bath 1 incorporating electrode plates 2 and 3 so that the belt body 4 can move along the length direction of the bath 1 and hinge bodies 7 which clamp one end section of a strip-like lead frame are pivotally fit to the belt body 4 at a plurality of locations. On the other hand, a first guide body 11 which changes the attitude of each hinge body 8 from a nearly horizontal attitude to a nearly downward attitude and a second guide body 13 which changes the attitude of each hinge body 7 from the nearly downward attitude to the nearly horizontal attitude are respectively provided at both end sections of the bath 1.;COPYRIGHT: (C)1993,JPO&Japio
机译:目的:在通过电镀等电解加工或电解对带状引线框架进行表面处理时,在减少不均匀处理发生的状态下连续进行表面处理;组成:环形输送带主体4设置在装有电极板2和3的电解槽1的上方,从而带状主体4可以沿槽1的长度方向移动,并且夹紧带状引线框架的一端部的铰链体7可枢转地装配。皮带主体4在多个位置处被固定。另一方面,第一引导体11将每个铰链体8的姿态从几乎水平的姿态改变为几乎向下的姿态,第二引导体13将每个铰链体7的姿态从几乎向下的姿态改变为几乎向下的姿态。浴槽1的两端分别设置了近乎水平的姿势。版权所有:(C)1993,JPO&Japio

著录项

  • 公开/公告号JP3096135B2

    专利类型

  • 公开/公告日2000-10-10

    原文格式PDF

  • 申请/专利权人 ローム株式会社;

    申请/专利号JP19920068817

  • 发明设计人 和田 憲二;

    申请日1992-03-26

  • 分类号H01L23/50;C25D17/06;

  • 国家 JP

  • 入库时间 2022-08-22 02:06:12

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