Manner of the pretinning of lead/read of the electronic parts which possess lead/read, the device, and the pretinning lead/read null of the electronic parts which

摘要

PURPOSE:To form an uniform solder coating film and to prevent solder from sticking on the member tip in a dumpling shape by increasing the first pulling-up speed of a member which is dipped in a solder bath and subjected to preliminary soldering and decreasing the speed at the finishing time when the member tip is pulled up. CONSTITUTION:An electronic part 29 is supported on hangers 15 of a lifting plate 14 and the speed of dip-in, the speed of the first stage of dip-out and the speed of the second stage of dip-out are controlled respectively by a sequencer 25. These values are regulated by volume of a manual operation part 26. Accordingly, the uniform solder coating film 33 is formed and the solder is prevented from sticking on the member tip in a dumpling shape. In addition, the coating film 33 of a part to be pulled up from the solder bath lastly is made thinner than the coating film 33 of other parts and the occurrence of trouble at the time of main soldering is prevented.