首页> 外国专利> Production manner null of the electronic parts which possess the lead/read

Production manner null of the electronic parts which possess the lead/read

机译:具有铅/铅读法的电子零件的生产方式为空

摘要

PURPOSE: To suppress generation of a solder ball at a lead terminal by covering an electronic component body in which the terminal is axially extended with an insulating sheath, heating it at a temperature of a melting point or higher of solder, feeding excess solder of a base end out of the sheath, and then bending the terminal along the sheath. ;CONSTITUTION: An inductor body 1 is formed by winding a winding 3 on a drum-shaped core 2, binding its end 4 with a base ends of lead terminals 7, 7 fixed in recesses 5, 5 formed on both end faces of the core 2 with adhesive 6 and conductively fixing with solder 8. An insulator of resin including the base end is covered with insulating sheath 9 by molding. Then, excess solder 8 of the base end of the terminal 7 is fed externally between the terminal 7 and the sheath 9, and so covered as to become a thin layer by extending toward the outer end of the terminal 7. Thereafter, the terminal 7 is bent along the sheath 9.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:通过用绝缘护套覆盖在端子轴向延伸的电子元件主体,并在焊料的熔点或更高的温度下对其进行加热,将过量的焊料送入引线盒中,以抑制引线端子上的焊球的产生。将基端从护套中取出,然后沿着护套弯曲端子。 ;组成:电感器主体1通过将绕组3缠绕在鼓形磁芯2上而形成,将其端部4与引线端子7、7的基端固定在一起,引线端子7、7的基端固定在形成在磁芯两个端面上的凹槽5、5中在图2所示的实施例中,通过粘合剂6和通过焊料8导电地固定。包括基端的树脂绝缘体通过模制被绝缘护套9覆盖。然后,将端子7的基端的多余的焊料8从外部送入端子7和护套9之间,并通过向端子7的外端延伸而覆盖成薄层。此后,端子7沿护套9弯曲。版权所有:(C)1994,JPO&Japio

著录项

  • 公开/公告号JP2826930B2

    专利类型

  • 公开/公告日1998-11-18

    原文格式PDF

  • 申请/专利权人 太陽誘電株式会社;

    申请/专利号JP19920347095

  • 申请日1992-12-25

  • 分类号H01F41/10;H01C17/28;H01F27/02;H01F27/29;H01F41/12;H01G4/228;

  • 国家 JP

  • 入库时间 2022-08-22 02:28:53

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号