Uniform etching mechanism to minimize the etch rate loading effect

摘要

(57) I to provide a method of etching the laminate structure of the summary on a substrate. The method is intended to include a step of etching the laminate to the stop point predetermined by using a reverse etch rate loading induced chemistry. The method also is intended to include also the step of using the etch rate loading order chemical properties, and etching the laminate includes a target layer in the laminate structure.