PLANE GRINDING METHOD, AND MIRROR POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To remove a ground streak trace with a small grinding amount by grinding a wafer surface with controlling cycle of the ground streak trace formed in the entire wafer surface ground by a grinding wheel to be less than a specific value.;SOLUTION: A grinding wheel 22 is fixed to the lower surface of an upper surface plate 14. A vacuum sucking mechanism capable of sucking and fixing a wafer W is provided on the upper surface of a lower surface plate 16. The wafer W to be ground is sucked or fixed to the upper surface of the lower surface plate 16 using the vacuum sucking mechanism. By rotating the upper and lower surface plate 14, 16, moving at least one surface plate vertically, and connecting it to the other surface plate by pressure, the surface of the wafer W fixed to the upper surface of the lower surface plate 16 is ground. At this time, as the grinding wheel 22, a resinoid grinding wheel is suitable. In addition, count of the grinding wheel 22 higher than #2000, fine particle size, is preferable. The wafer W surface is ground with controlling cycle of the ground streak trace formed in the entire wafer W surface ground by the grinding wheel 22 to be less than 1.6 mm.;COPYRIGHT: (C)2000,JPO