The semiconductor device retention socket in order to use for the hot performance test of the semiconductor device

摘要

Abstract Topic In order to use for the hot performance test of the semiconductor deviceInstallation job of the semiconductor device in the semiconductor device retention socketAnd it improves the efficiency of job of the removal. Solutions To accommodate semiconductor device 8, connector terminal 12Being movable vis-a-vis the substance section 2 which it has, the pushing it overpowers semiconductor device 8A pushing pressure cancellation state where it is segregated from ru pushing pressure state and semiconductor device 8It has the pushing pressure section 6 which is taken. As for pushing pressure section 6, in substance section 2 confrontingWith the hinge which includes time driving axle 4 time motion possibly installation,Substance section 2 the connected component 2 which consists of 2 directivity form memory alloysIt is connected by 0. As for connected component 20, end 20a, 20b in substance section to be locked 2 and pushing pressure section 6, the intermediate section20c the circumference has done time driving axle 4, at pyrometry temperature the pushingIn order to take pushing pressure state, vis-a-vis pressure section 6 to impress attaching power, normal temperatureBeing similar, it maintains pushing pressure section 6 in pushing pressure cancellation state. Pushing pressure section 6 pushingAt the time of pressure state, semiconductor device input/output terminal 9 inside concave section 10The dew the pushing it is overpowered vis-a-vis the connector terminal 12 which can be put out.