MOUNTING STRUCTURE OF ELECTRONIC PARTS VIA HOT-MELT MATERIAL, MOUNTING METHOD OF THE ELECTRONIC PARTS AND PROJECTOR PROVIDED WITH THE MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To prevent drop of solder, to reduce escape of heat necessary for soldering and further to reduce heat conducted to a liquid crystal panel. SOLUTION: A projector is provided with liquid crystal panels 7, 7a, 7b corresponding to respective rays of R, G and B, a prism body 30 synthesizing rays passing through the liquid crystal panels 7, 7a, 7b and supporting frames 2, 2, 2 arranged to face a peripheral surface of the prism body 30 in a chassis 3. The liquid crystal panels 7, 7a, 7b are attached to a frame body 1 made of a metal and are respectively fixed to corresponding supporting frames 2. A supporting piece 20 is provided with the supporting frame 2, a hot-melt material is arranged between the frame body 1 and the supporting piece 20 and a receiving piece 21 preventing drop of the heated and molten hot-melt material projects in the vicinity of a place to be heated from the lower end part of the supporting piece 20. On the frame body 1 on a side nearer to the liquid crystal panels 7, 7a, 7b than the place of the hot-melt material to be heated from above, a place where a passage of fusion heat to the hot-melt material is narrower than that at the heating place is provided.