METHOD FOR FITTING ELECTRONIC PART TO SUBSTRATE AND FITTING DEVICE FOR ELECTRONIC PART USING THE SAME

摘要

PROBLEM TO BE SOLVED: To keep a positioning precision in printing solder, etc., on a substrate and mounting of an electronic part with a simple structure and to prevent the substrate from warping at re-flow. ;SOLUTION: Related to a fitting method for an electronic part on a substrate wherein an electronic part is allocated at a specific part on a substrate 1 for fitting, the substrate is fitted by a substrate fitting means 4 while a plurality of positioning members 5 provided to the substrate fitting means are positioned around a portion 2 of the substrate where an electronic part is fitted, and the positioning member is used as a reference for specifying the print place at printing solder, etc., on the substrate or specifying the mounting place for the electronic part, so that re-flow is performed with the substrate fitted by the substrate fitting means.;COPYRIGHT: (C)2000,JPO