首页> 外国专利> ELECTRONIC ELEMENT SEALING PACKAGE, ELECTRONIC ELEMENT SEALING STRUCTURE, AND MANUFACTURE OF ELECTRONIC ELEMENT SEALING STRUCTURE

ELECTRONIC ELEMENT SEALING PACKAGE, ELECTRONIC ELEMENT SEALING STRUCTURE, AND MANUFACTURE OF ELECTRONIC ELEMENT SEALING STRUCTURE

机译:电子元件密封组件,电子元件密封结构以及电子元件密封结构的制造

摘要

PROBLEM TO BE SOLVED: To provide electromagnetic shielding effect by providing a base or cap of an electronic element sealing package with a magnetism by dispersing a magnetic metal powder in a ceramic material. ;SOLUTION: Related to an electronic element sealing package 10, a cap 12 formed by extruding a metal material is covered on a base 11 of a ceramic material, to seal an electronic element 16. A magnetic metal powder is diffused in the ceramic used as the material of the base 11 to provide a magnetism, thus the base 11 playing a role for electromagnetic shielding. Thus, nothing affects on the electronic element 16 sealed inside the electronic element sealing package 10, and even when the electronic element 16 sealed inside generates a strong electromagnetic wave, the electromagnetic wave is prevented from leaking outside.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:通过将磁性金属粉末分散在陶瓷材料中,使电子元件密封包装的底部或盖子具有磁性,从而提供电磁屏蔽效果。 ;解决方案:关于电子元件密封包装10,通过挤压金属材料形成的盖12被覆盖在陶瓷材料的基底11上,以密封电子元件16。基座11的材料提供磁性,因此基座11起到电磁屏蔽的作用。因此,对密封在电子元件密封包装件10内部的电子元件16没有任何影响,并且即使在内部密封的电子元件16产生强电磁波的情况下,也可以防止电磁波泄漏到外部。版权所有:(C)2000,日本特许厅

著录项

  • 公开/公告号JP2000049247A

    专利类型

  • 公开/公告日2000-02-18

    原文格式PDF

  • 申请/专利权人 NEC KANSAI LTD;

    申请/专利号JP19980214557

  • 发明设计人 KISHI EIGO;ISHIJIMA MASAYA;

    申请日1998-07-29

  • 分类号H01L23/06;H03H9/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:01:37

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