ELECTRONIC ELEMENT SEALING PACKAGE AND ELECTRONIC ELEMENT SEALING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To enable an electronic element sealed up inside to be shielded effectively from an outer electromagnetic field. ;SOLUTION: An electronic element sealing package 10 is composed of a ceramic base 11 and a cap 12 of conductive material put on the ceramic base 11, wherein the surface of the cap 12 is coated with a metal thin film 13 of gold and/or silver, conductive adhesive agent 14 is applied on the metal thin film 13, and the cap 12 is mounted on the ceramic base 11 and connected to a grounding potential through the intermediary of a grounding electrode 15 provided on the ceramic base 11.;COPYRIGHT: (C)2000,JPO