RESIN COMPOSITION FOR SEALING ELECTRONIC PART, ITS PRODUCTION AND SEALED ELECTRONIC PART USING THE SAME RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition for sealing an electronic part excellent in moisture resistant reliability and molding property. ;SOLUTION: This resin composition consists of (A) a linear chain type polyarylenesulfide resin, (B) an inorganic ion-exchanging substance, (C) a polymer having an adhesive property or a tacky property and (D) an inorganic filler. By blending (B) the inorganic ion-exchanging substance and (C) the polymer having the adhesive property or tacky property, it is possible to elevate the moisture resistant reliability and molding property of the composition.;COPYRIGHT: (C)2000,JPO