PROBLEM TO BE SOLVED: To prevent electromagnetic waves from leaking outside of a semiconductor device manufacturing apparatus by a method wherein the manufacturing apparatus has a container surface provided with a countermeasure against electromagnetic waves.;SOLUTION: A front open integnal type pod(FOUP) 20 or a standard mechanism interface pod(SMIFPOD) is formed of a resin and meshy metal 36 are arranged or the inner wall of this pod at a prescribed pitch. The smaller the mesh pitch is, the greater the effect is, but the pitch is to be set so as to establish a desired value of at most 100 dB in the range of a frequency of 9 kHz-300 MHz. The surfaces of the metal on this inner wall and the resin are formed into the same surface and the metal is formed not to appear on the surface. Moreover, the meshy metal is arranged to the surface in contact with an opener flange, of a flange 35 of this pod. In the case where this FOUP 20 is loaded on a container surface and is pressed to the opener flange, the metal on the inner wall of this pod and the opener flange which is ground, are brought into contact with each other to be placed in a state of being ground.;COPYRIGHT: (C)2000,JPO
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