首页> 外国专利> CUTTING TOOL MADE OF HARD SINTERED MATERIAL COATED WITH ARTIFICIAL DIAMOND, EXCELLENT IN CHIPPING RESISTANCE

CUTTING TOOL MADE OF HARD SINTERED MATERIAL COATED WITH ARTIFICIAL DIAMOND, EXCELLENT IN CHIPPING RESISTANCE

机译:硬质合金硬质合金涂层切削刀具,具有出色的抗切削性

摘要

PROBLEM TO BE SOLVED: To provide a cutting tool made of hard sintered material coated with artificial diamond, excellent in chipping resistance. ;SOLUTION: This cutting tool is constituted by forming an artificial diamond film on the surface of a base material of hard sintered material consisting of any of a base material of tungsten-carbide-base cemented carbide, a base material of titanium carbonitride cermet, and a base material of silicon nitride ceramics to 5-200 μm average layer thickness. At this time, the artificial diamond film has, from the observation on the longitudinal section under a scanning electron microscope, a mixed structure of a laminated grain where a thin diamond crystal layer and a thin amorphous carbon layer are alternately laminated at fine pitches to form a striped pattern and a diamond crystal grain, and the laminated grain comprises 10-70 area % of the mixed structure.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:提供一种切削工具,该切削工具由涂覆有人造金刚石的硬质烧结材料制成,具有出色的抗崩刃性。 ;解决方案:这种切割工具是在硬质烧结材料的基材表面上形成人造金刚石膜,而硬质烧结材料的基材由碳化钨基硬质合金的基材,碳氮化钛金属陶瓷的基材和氮化硅陶瓷的基材,平均层厚为5-200μm。此时,从在扫描电子显微镜下的纵截面观察,人造金刚石膜具有以细间距交替层叠金刚石细晶体层和非晶碳薄层而形成的层叠颗粒的混合结构。条纹图案和菱形晶粒,叠层晶粒占混合结构的10-70面积%。;版权所有:(C)1999,JPO

著录项

  • 公开/公告号JPH11350139A

    专利类型

  • 公开/公告日1999-12-21

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP19980155748

  • 发明设计人 YOSHIKAWA HIROMICHI;

    申请日1998-06-04

  • 分类号C23C16/26;B23B27/14;C04B41/89;

  • 国家 JP

  • 入库时间 2022-08-22 01:59:34

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