首页> 外国专利> CUTTING METHOD FOR STICKING SHEET, CUTTING DEVICE AND STICKING METHOD FOR STICKING SHEET

CUTTING METHOD FOR STICKING SHEET, CUTTING DEVICE AND STICKING METHOD FOR STICKING SHEET

机译:粘纸的切割方法,粘纸的切割装置以及粘纸的方法

摘要

PROBLEM TO BE SOLVED: To provide a cutting method for sticking sheet for sticking the sticking sheet by a simple work, a cutting device used for the cutting, and a sticking method for the sticking sheet. ;SOLUTION: A pressure sensitive adhesive sheet 18 is cut together with a mold release paper 19 using a cutting device having a cutter capable of traveling to a standing-by position opposing to the adhesive sheet 18 at a predetermined interval and a cutting position which comes into contact with the adhesive sheet 18 to cut it freely. When it is cut, parts left uncut are formed on the adhesive sheet 18 to be cut and the mold release paper 19 due to the travel of this cutter to the cutting position and the standing-by position. The part left uncut of the mold release paper 19 is cut to remove the mold release paper 19, and after the adhesive sheet 18 is stuck, the part left uncut of the adhesive sheet 18 is cut to remove an unnecessary part of the adhesive sheet 18.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:提供一种用于通过简单的工序将粘贴片粘贴的粘贴片的切断方法,用于该切断的切断装置以及粘贴片的粘贴方法。 ;解决方案:使用具有切割器的切割装置将压敏粘合片18与脱模纸19一起切割,所述切割器能够以预定的间隔行进到与粘合片18相对的待机位置,并且切割位置为与粘合片18接触以自由切割。当切割时,由于该切割器向切割位置和待机位置的行进,在待切割的粘合片18和脱模纸19上形成了未被切割的部分。切断脱模纸19的未切割部分以去除脱模纸19,并且在粘贴粘合片18之后,切割粘合片18的未切割部分以去除粘合片18的不必要的部分。 。;版权:(C)2000,日本特许厅

著录项

  • 公开/公告号JP2000033596A

    专利类型

  • 公开/公告日2000-02-02

    原文格式PDF

  • 申请/专利权人 BROTHER IND LTD;

    申请/专利号JP19980204868

  • 申请日1998-07-21

  • 分类号B26D3/08;B26D5/20;

  • 国家 JP

  • 入库时间 2022-08-22 01:59:00

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