首页> 外国专利> TAPE CUTTING DEVICE, TAPE CUTTING METHOD USING THE DEVICE, TAPE STICKING DEVICE HAVING THE DEVICE AND TAPE STICKING METHOD USING THE TAPE STICKING DEVICE

TAPE CUTTING DEVICE, TAPE CUTTING METHOD USING THE DEVICE, TAPE STICKING DEVICE HAVING THE DEVICE AND TAPE STICKING METHOD USING THE TAPE STICKING DEVICE

机译:胶带切割装置,使用该装置的胶带切割方法,具有该装置的胶带粘贴装置以及使用胶带粘贴装置的胶带粘贴方法

摘要

PROBLEM TO BE SOLVED: To prevent sticking of a tape to a cutting blade in cutting the tape having a plane provided with a pressure sensitive adhesive layer.;SOLUTION: This tape cutting device cuts the tape having the plane provided with the pressure sensitive adhesive layer. The tape cutting device includes a first blade and a second blade arranged so as to cooperate for cutting the tape by relatively moving toward mutual ones. The first blade is arranged so as to be positioned on the plane side to the tape, and has a projection part projecting in the plane direction more than the tip of a blade, on an end surface continuing with the tip of the blade of the first blade and opposed to the plane, and the second blade is arranged so as to be positioned on the plane side on the opposite side of the plane to the tape.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:为了防止胶带在切割具有带有压敏粘合剂层的平面的胶带时将胶带粘到切割刀片上;解决方案:该胶带切割装置切割具有带有压敏粘合剂层的平面的胶带。 。带切割装置包括第一刀片和第二刀片,第一刀片和第二刀片布置成通过相对于彼此相对移动而协作以切割带。第一刮板被布置成位于带的平面侧,并且在与第一刮板的刮板的尖端连续的端面上具有在平面方向上比刮板的尖端突出的突出部。刀片并与该平面相对,第二个刀片被布置为位于与磁带相反的平面的平面上。;版权所有(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2011230230A

    专利类型

  • 公开/公告日2011-11-17

    原文格式PDF

  • 申请/专利权人 CANON INC;

    申请/专利号JP20100102588

  • 发明设计人 YONEDA ISAMU;

    申请日2010-04-27

  • 分类号B26D1/08;B26D1/02;B65H35/07;

  • 国家 JP

  • 入库时间 2022-08-21 17:42:16

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