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IMPROVING METHOD OF ADHESION PROPERTY OF RESIN TO COPPER SURFACE AND ELECTROLESS COPPER PLATING BATH WITH HIGH ADHESION PROPERTY TO BE USED FOR THAT METHOD
IMPROVING METHOD OF ADHESION PROPERTY OF RESIN TO COPPER SURFACE AND ELECTROLESS COPPER PLATING BATH WITH HIGH ADHESION PROPERTY TO BE USED FOR THAT METHOD
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机译:树脂对铜表面的附着性能的改进方法以及具有高附着力的无电铜镀液的使用方法
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摘要
PROBLEM TO BE SOLVED: To improve adhesion property with a resin without changing the structure of a copper surface by dipping a copper coating film in an electroless copper plating bath coating a sulfur compd. ;SOLUTION: As for a sulfur compd. to be added to an electroless copper plating bath, a sulfide inorg. compd. such as sodium sulfide and ammonium hydrogen sulfide, a thiocyanate compd. such as thiocyanic acid, an org. sulfide compd. such as thiomalic acid, thioglycolic acid are exampled and it is desirably added by about 0.01 to 50 mg/L in the electroless plating bath. As for the electroless copper plating bath in which the sulfur compd. is added, a normal electroless copper plating bath can be used, and as for a reducing agent, formaldehyde or its deriv. is preferably used. In the electroless plating bath, formaldehyde, a hypophosphite or its derives. are used as the reducing agent and for other than those, copper nitrate as a copper ion source, tartaric acid or its salt as a complexing agent of a copper ion can be used. It may be enough to dip a copper film in the plating bath at 50 to 70°C for about 5 to 30 min.;COPYRIGHT: (C)2000,JPO
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