SOCKET APPARATUS PARTICULARLY ADAPTED FOR BGA TYPE SEMICONDUCTOR DEVICES

摘要

A socket (1) for removably receiving semiconductor devices (8) for testingpurposes has film contacts (81) each having a continuous or discontinuousannulus (71, 73, 76, 78) that has been formed on a film substrate and with arecess (72, 74, 77, 79) formed within the annulus exposed at a bottom of aseating or accommodating portion (31). When a BGA type semiconductor device(8) is received in the accommodating part (31) and a cover (16) is closed,electrically conductive balls (9) on the bottom of the semiconductor device (8) arepressed against respective film annular contacts (81, 82, 83, 84) therebyeffecting an electric connection. Since the bottom most portion of the electricallyconductive balls (9) are located within the recesses of the annular contacts, theywill not be deformed. Since the film contacts (81) are prepared by etching andplating, the pitch can be easily narrowed, or otherwise modified.