Fabrication method of thermocouple wafer and temperature measurement method by using thermocouple wafer

摘要

PURPOSE: A method of fabricating a wafer for measuring a temperature and method for measuring a temperature using the wafer is to precisely and rapidly measure a change in a temperature of the wafer at any conditions. CONSTITUTION: A method of fabricating a wafer for measuring a temperature comprises the steps of forming a dielectric layer on a wafer, forming a first metal layer on the dielectric layer, patterning the first metal layer to form a first strand of which one end is formed at a position for measuring the temperature and the other end is formed into a pad, forming a second metal layer for forming a second strand on the wafer, and patterning the metal layer to form the second strand. A method for measuring a temperature using the wafer comprises steps of forming a plurality of thermocouples on the wafer, densely forming the pads of the thermocouples at a desired limited area and constantly maintaining a temperature of the pads, defining a base one out of the thermocouples to measure the temperature of the pad, connecting an extending line only to the base thermocouple, connecting a wire with the extending line to fix a base contact between the extending line and the wire, and measuring the temperature at the base contact.