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Perforated workpiece especially an optical or mechanical filter with micron or sub-micron size pores

机译:穿孔的工件,尤其是具有微米或亚微米尺寸孔的光学或机械过滤器

摘要

A perforated workpiece, comprising a silicon substrate (1) having a first region (6) with through-pores (4) and a second region (7) with blind pores, is new. An Independent claim is also included for producing a perforated workpiece by electrochemically etching one face (2) of a silicon substrate (1) to form pores (4) of depth less than the substrate thickness, providing the opposite substrate face (3) with a mask layer which exposes first regions (6) of this opposite substrate face, etching the exposed face regions (6) to the bottoms of the pores (4) and then removing the mask layer.
机译:新型的穿孔工件是新型的,它包括一个硅基板(1),该基板具有带通孔(4)的第一区域(6)和带盲孔的第二区域(7)。还包括独立权利要求,用于通过电化学蚀刻硅衬底(1)的一个面(2)以形成深度小于衬底厚度的孔(4),从而在相对的衬底面(3)上提供穿孔,从而制造穿孔工件。掩模层,该掩模层暴露该相对的衬底表面的第一区域(6),将暴露的表面区域(6)蚀刻到孔(4)的底部,然后去除掩模层。

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