Thin substrate layers, especially thin IC chips, are produced from two bonded substrates

摘要

A thin substrate layer is produced from two bonded substrates (1, 2) having interface channel recesses (5) for etchant penetration. A thin substrate layer is produced by: (a) bonding two substrate front faces using one or more intermediate bonding layers (3, 4), at least one of the bonding layers or the front face of one of the substrates (1, 2) having channel-like recesses (5) which allow sideways penetration of an etchant; (b) thinning one substrate (1) down to a substrate layer (1a); and (c) detaching the substrate layer from the other substrate (2) by introducing etchant into the recesses. An Independent claim is also included for a substrate structure resulting from step (a) of the above process.