Chip production, especially for a chip card, comprises applying metallization onto a thinned finished chip wafer, bonded to a handling wafer, for connection by vias to the chip metallization and/or circuit structure

摘要

IC production comprises applying a metallization onto a thinned finished wafer bonded to a handling wafer for connection by vias to the finished wafer metallization (2, 3) and/or circuit structure (1). An IC production process comprises providing via holes to the back face of a first substrate having a circuit structure (1) and an overlying metallization structure (2, 3), insulating the via holes from the circuit structure, applying a planarizing layer over the metallization structure, bonding the resulting first wafer to a handling wafer, thinning the first wafer from the back face to expose the via holes or their metallized connections and applying a second metallization structure on the chip back face for connection by the vias with the first metallization structure and/or the circuit structure. Independent claims are also included for the following: (i) an IC produced by the above process; (ii) a module for incorporation in a chip card, the module comprising the above IC; and (iii) a chip card having the above IC or module.