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Security element for electronic articles has dielectric layer at least as thick in critical region, where bounding edge of lower/upper track overlaps other track, as in rest of overlap region
Security element for electronic articles has dielectric layer at least as thick in critical region, where bounding edge of lower/upper track overlaps other track, as in rest of overlap region
The security element has a lower (2) and an upper (3) conducting track, each with a winding, whereby both conducting tracks are wound in opposite directions, overlap in at least one overlap region and have a dielectric layer in the overlap region between the conducting tracks. The dielectric layer has at least the same thickness in a critical region (7), in which a bounding edge (5) of the lower or upper conducting track overlaps the other track, as in the rest of the overlap region. An Independent claim is also included for a method of manufacturing a security element.
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