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Lead frame for integrated circuits and process of packaging
Lead frame for integrated circuits and process of packaging
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机译:集成电路引线框架和封装工艺
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摘要
A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).
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