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Short channel IGBT with improved forward voltage drop and improved switching power loss

机译:具有改善的正向压降和改善的开关功率损耗的短通道IGBT

摘要

A cellular insulated gate bipolar transistor ("IGBT") device has a reduced length of the channels of the individual cells that is formed by reducing the channel drive in time from the customary 120 minutes at 1175. degree. C. to between 60 and 90 minutes at 1175 C. The process also permits the use of a higher minority carrier lifetime killing electron radiation dose to improve switching power loss while reducing SOA by only a small value. Alternatively, the increased concentration region located in the active region between spaced bases is initially driven in at a temperature of about 1175 C. for about 12 hours, rather than the customary 8 hours, and the channel drive in time is reduced from 120 minutes to 60 minutes. The shorter channel length, when combined with the deeper enhancement region, allows for higher lifetime electron irradiation doses or heavy metal diffusion temperatures.
机译:蜂窝绝缘栅双极晶体管(“ IGBT”)器件具有减小的单个单元的沟道长度,这是通过从1175度的通常120分钟的时间上减小沟道驱动时间而形成的。在1175℃下加热至60至90分钟之间。该方法还允许使用较高的少数载流子寿命来杀死电子辐射剂量,以改善开关功率损耗,同时仅将SOA减小很小的值。可替代地,位于间隔开的碱基之间的活性区域中的增加的浓度区域最初在约1175℃的温度下被驱动约12小时,而不是通常的8小时,并且通道驱动时间从120分钟减少至60分钟当与较深的增强区结合时,较短的沟道长度允许较高的寿命电子辐照剂量或重金属扩散温度。

著录项

  • 公开/公告号US6008092A

    专利类型

  • 公开/公告日1999-12-28

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL RECTIFIER CORPORATION;

    申请/专利号US19970786023

  • 发明设计人 HERBERT J. GOULD;

    申请日1997-01-21

  • 分类号H01L21/336;

  • 国家 US

  • 入库时间 2022-08-22 01:38:29

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