Electrophoretic coating methodology to improve internal package delamination and wire bond reliability

摘要

Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The principles of the present invention contemplate electrostatically depositing an exceptionally uniform coating on electronic components, especially microchips, and more especially still, on integrated circuits prior to the encapsulation of the electronic components into plastic-packaged components. The coating, for instance applied to a completed leadframe assembly, including die and wire bonds, serves two purposes. It improves adhesion of the molding compound forming the package, thereby reducing the chances for delamination of the package. The coating also isolates the relatively fragile wire bonds, including their attachment points to the chip and the bonding pads and the leads, from chemical and metallurgical attack by the flame retardant found in many molding compounds.