首页> 外国专利> Integrated circuit memory devices having highly integrated merged data test capability and methods of testing same

Integrated circuit memory devices having highly integrated merged data test capability and methods of testing same

机译:具有高度集成的合并数据测试能力的集成电路存储设备及其测试方法

摘要

Integrated circuit memory devices having merged data test capability include first and second memory cell arrays in first and second blocks of memory, respectively, a first global input/output line and switches for enabling transfer of data from the first memory cell array to the first global input/output line in response to a first merged data test control signal P1 and enabling transfer of data from the second memory cell array to the first global input/output line in response to a second merged data test control signal P2. A highly integrated merged data test circuit is also provided with test cells therein and each test cell is capable of testing multiple memory cell arrays in at least two blocks of memory. A first merged data test circuit is provided which has a first input electrically coupled to the first global input/output line and a first output which generates first and second error signals upon detection of a failure in the first and second memory cell arrays, respectively.
机译:具有合并数据测试能力的集成电路存储设备包括分别在第一和第二存储块中的第一和第二存储单元阵列,第一全局输入/输出线以及用于使能从第一存储单元阵列到第一全局存储单元的数据传输的开关。输入/输出线响应于第一合并数据测试控制信号P1,并且能够响应于第二合并数据测试控制信号P2将数据从第二存储单元阵列传输到第一全局输入/输出线。高度集成的合并数据测试电路中还设有测试单元,并且每个测试单元能够测试至少两个存储器块中的多个存储器单元阵列。提供第一合并数据测试电路,其具有电耦合到第一全局输入/输出线的第一输入和在分别检测到第一和第二存储单元阵列中的故障时生成第一和第二误差信号的第一输出。

著录项

  • 公开/公告号US6052320A

    专利类型

  • 公开/公告日2000-04-18

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US19980123878

  • 发明设计人 JIN-SEOK KWAK;

    申请日1998-07-28

  • 分类号G11C8/00;

  • 国家 US

  • 入库时间 2022-08-22 01:37:22

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