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Resin constituent for copper-clad laminate, resin equipped copper foil, multilayer copper-clad laminate and multilayer printed wiring board
Resin constituent for copper-clad laminate, resin equipped copper foil, multilayer copper-clad laminate and multilayer printed wiring board
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机译:用于覆铜层压板的树脂成分,装有树脂的铜箔,多层覆铜层压板和多层印刷线路板
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摘要
There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.
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